Computational Study of Functional Materials for Device Applications

Materials Science and Engineering Seminar

Dr. Liwei Geng

Department of Materials Science and Engineering
Michigan Technological University

Abstract: Functional materials, such as ferroic and multiferroic materials, usually promise to create novel electronic and spintronic devices. Multiscale computations consisting of ab initio calculation at the quantum level, spin dynamics simulation at the atomistic level, and phase field modeling at the domain level are employed to study the structures, properties, functionalities, and mechanisms of materials for novel devices and technologies. In particular, phase field modeling is rather prominent in device applications. This talk will focus on the computational study for two classes of devices, namely, the digital devices and the analog devices. For the digital devices, novel spintronic devices based on magnetic domain walls are proposed with the aid of micromagnetic simulations, while for the analog devices, a new class of magnetoelectric component, voltage tunable inductors, is computationally studied.

Bio: Dr. Liwei Geng is a postdoctoral research fellow in Materials Science and Engineering at Michigan Tech working with Prof. Yu Wang.  His current project focuses on materials modeling and computer simulation of ferroelectric, piezoelectric, and magnetoelectric materials for tunable energy efficient electronics (TE3) applications. He received his PhD in Materials Science and Engineering at Michigan Tech under the guidance of Prof. Yongmei Jin in 2015. His PhD research mainly focused on the computational study of structures, properties, and functionalities of ferromagnetic domain walls in bulk materials, thin films, nanowires, and atomic chain systems.

Tuesday, February 26 at 11:00 am to 12:00 pm

Minerals and Materials Engineering Building (M&M), 610
1400 Townsend Drive, Houghton, MI 49931

Event Type

Academics, Lectures/Seminars

Target Audience

Students, Graduate, Faculty/Staff


Subscribing Departments ?
Materials Science and Engineering, College of Engineering
Host ?

Department of Materials Science and Engineering


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